According to Taiwanese newspaper, the Economic Daily News Infineon Technoloiges’ 3G baseband chip will be produce by the United Microelectronics Corporation for the 3G iPhone model.

The UMC have been contracted to produce the PMB8878 chipset on Infineon’s behalf which will be manufactured on UMC’s 65nm line.

The firts-generation iPhone’s baseband chip was also an Infineon design, with the The Taiwan Semiconductor Manufacturing Company (TSMC) as the foundry partner. It’s unclear as to whether TSMC made a bid for this new contract or not.

The newspaper article doesn’t mention however when production is expected to begin on the new chipset.

[via DigiTimes]

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Taiwanese Newspaper Confirms 3G iPhone Infineon Chip